From its origins as vast, untouched sugarcane fields to its evolution into a global nexus for advanced semiconductor manufacturing, the Southern Taiwan Science Park (STSP) celebrated its 30th anniversary with a milestone event. To honor the partners who have fueled this transformation, the STSP Bureau of the National Science and Technology Council (NSTC) hosted the “STSP at 30: Moving Forward Together” gala at ICC Tainan. The event drew high-level dignitaries, including Executive Yuan Advisor Li Meng-yan, Deputy Minister of Economic Affairs Ho Chin-tsang, and Deputy Minister of the Ocean Affairs Council Wu Hsin-hsiu, joining representatives from across sectors to review three decades of growth and chart a blueprint for the next generation.

 

NSTC Minister Wu Cheng-wen remarked that STSP has grown from the ground up to become a pivotal global hub for the semiconductor and AI industries. Amidst the new wave of AI-centric technology, the government is spearheading the “10 New AI National Projects,” leveraging semiconductors as the industrial engine and AI as the primary driver to accelerate Taiwan’s transition into a “Smart Tech Island.” STSP will continue to play a critical role in the development of the “New Southern Silicon Valley.”

 

STSP Bureau Director-General Cheng Hsiu-jung noted that the park’s steady growth is the result of long-term corporate commitment and seamless collaboration between central and local governments, academia, and the medical sector. Since the park’s output value first crossed the NT$300 billion threshold in 2005, it has seen twenty years of robust accumulation, with 2025 projections nearing NT$3 trillion—underscoring STSP’s status as a fundamental pillar of Taiwan’s high-tech economy.

 

A centerpiece of the event was the “Contribution to STSP” awards, which presented honors such as the “STSP Bedrock Award,” “Excellence in Growth Award,” “Park Pioneer Award,” and “Sustainable Growth Award” to key enterprises that laid the foundation for the park’s success. The gala also featured a keynote by TSMC Executive Vice President and Co-COO Y.P. Chyn, titled “30 Years of STSP: Growing Together with TSMC.” Chyn shared the pivotal history of TSMC establishing Fab 6 at STSP—which at the time was the world’s largest 8-inch wafer fab. He emphasized that this strategic decision was the moment the global community began to take notice of STSP. As the park’s first major tenant, TSMC’s continuous investment in advanced processes has not only bolstered Taiwan’s competitive edge but also epitomizes the industrial strength and development potential STSP has accumulated.

 

At this “30-year inflection point,” STSP is committed to further harmonizing high-tech development with ecological sustainability. By strengthening park resilience and linking with local communities, the bureau aims to create an environment ideal for both living and professional innovation. Standing on thirty years of achievement, STSP will continue to work alongside all sectors to face future challenges and write the next chapter of shared prosperity.

 

News link：https://n.yam.com/Article/20260205301692