From its humble beginnings in vast sugarcane fields to three decades of relentless cultivation, the Southern Taiwan Science Park (STSP) has transformed into a world-class technology hub, spearheading global advanced semiconductor manufacturing. To honor the partners who have journeyed with the park, the Southern Taiwan Science Park Bureau of the National Science and Technology Council (NSTC) hosted the “STSP at 30: Moving Forward Together” gala yesterday (March 30) at ICC Tainan. The event gathered leaders from industry, government, academia, research, and medicine to reflect on 30 years of growth and unveil the blueprint for the next generation.

The ceremony was attended by high-level officials, including Executive Yuan Advisor Li Meng-yan, Deputy Minister of Economic Affairs Ho Chin-tsang, and Deputy Minister of the Ocean Affairs Council Wu Hsin-hsiu, signaling strong government endorsement of STSP’s achievements. NSTC Minister Wu Cheng-wen noted in his keynote that STSP has evolved from nothing to a cornerstone of the global semiconductor and AI sectors. In response to the AI-centric tech wave, the government is pushing the “10 New AI National Projects,” using semiconductors as the industrial engine and AI as the key driver to accelerate Taiwan’s transition into a “Smart Tech Island,” with STSP serving as the vital anchor of the “New Southern Silicon Valley.”

STSP Bureau Director-General Cheng Hsiu-jung remarked that the park’s success was built through long-term corporate investment and close collaboration across the ecosystem. Since the park’s output value first surpassed NT$300 billion in 2005, it has seen two decades of robust growth, with 2025 projections nearing the NT$3 trillion mark—solidifying STSP’s status as a pillar of Taiwan’s economy and the core of the Southern Tech Corridor.

A highlight of the event was the “Contribution to STSP” awards, honoring key enterprises in categories such as “STSP Bedrock,” “Excellence in Growth,” “Pioneer of the Park,” and “Sustainable Growth.” During the ceremony, TSMC Executive Vice President and Co-COO Y.P. Chyn delivered a speech titled “30 Years of STSP: Growing Together with TSMC.” He recounted the pivotal moment TSMC entered the park to establish Fab 6, which was then one of the world’s largest 8-inch wafer fabs and put STSP on the global map. As the first major tenant, TSMC’s continued investment in advanced processes has secured Taiwan’s global competitive edge and marked STSP’s transition from a local park to the world stage.

Nearly 400 representatives celebrated this milestone, witnessing the realization of the “New Southern Silicon Valley.” At its 30-year inflection point, STSP aims to deepen the harmony between high-tech development and ecological sustainability. By enhancing resilience, perfecting infrastructure, and linking with local communities, the park strives to create an environment ideal for living, working, and innovation. The STSP Bureau pledged to continue working with industry partners to carry forward the achievements of the past 30 years into a new chapter of shared prosperity.

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